Colorless Polyimide Film Product Specifications Attribute Value Temperature Resistance Up to 200°C Dielectric Constant 3.4 Flexibility Highly Flexible ...
Polyimide Core Film Used in Flexible Printed Circuits and Semiconductor Packaging Detail Information Place of Origin: ANHUI, CHINA Certification: UL ....
Durable Copper-Polyimide Composite Solution for Repeated Flexing Applications Product Overview: The GL series sets a fresh benchmark in polyimide film ...
FPC Film-Standard Black Opaque Polyimide Composite Flexible Circuit Substrate Product Overview GB-Type Black Polyimide Film delivers a unique blend of ...
Product Overview This advanced polyimide coverlay film represents a breakthrough in circuit protection technology, combining a ultra-thin polyimide .....
5G & High-Speed Circuit Substrate Product Overview Our 5G & High-Speed Circuit Substrate is an advanced high-frequency material engineered to meet the ...