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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry

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Home / Products / FPC Film / Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation /

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PI Material

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Polyimide PI Film

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Polyimide Insulation Tape

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Transparent Polyimide Film

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Copper Clad Polyimide Film

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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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City:hefei
Country/Region:china
Contact Person:MrJihao
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Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation
Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation
  • Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation
  • Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation
  • Black Opaque FPC Film with High Adhesion Strength for Flexible Circuits Offering Thermal Stability and Electrical Insulation
Products Detailed
FPC Film-Standard Black Opaque Polyimide Composite Flexible Circuit Substrate Product Overview GB-Type Black Polyimide Film delivers a unique blend of ...
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