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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry

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Copper-coated polyimide film applied in flexible circuit scenarios

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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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City:hefei
Country/Region:china
Contact Person:MrJihao
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China Copper-coated polyimide film applied in flexible circuit scenarios wholesale
  • China Copper-coated polyimide film applied in flexible circuit scenarios wholesale
  • China Copper-coated polyimide film applied in flexible circuit scenarios wholesale

Copper-coated polyimide film applied in flexible circuit scenarios
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Brand Name :Guofeng
Model Number :25um
Certification :SGS Reach ROHS
Place of Origin :China
MOQ :150kg
Price :$300-$30000
Payment Terms :L/C,T/T
Supply Ability :Negotiation
Delivery Time :7 Working Days
Packaging Details :Standard Packing
Cladding Material :Copper
Surface Treatment :Chemical Etching
Material :Polyimide
Adhesive Type :Acrylic
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Copper-coated polyimide film applied in flexible circuit scenarios
Product Overview:

The GL series represents a breakthrough in polyimide film performance. Its exclusive manufacturing process forms a distinctively oriented molecular structure, enhancing critical properties—including tensile strength, dimensional stability, and chemical resistance—by a steady 30%. This adaptable, inherently yellow film offers customizable thickness options and serves as the perfect solution for high-demand applications such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Robust Mechanical Durabilit

Exceptional Dimensional Integrity

Excellent Lamination Performance
Compliant with RoHS and REACH


Product Applications:
  1. Acts as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL)
  2. Serves as a cover layer with exceptional dimensional stability
  3. Utilized in the packaging of semiconductor chips
  4. Functions as a base film for specialized adhesive tapes



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Copper-coated polyimide film applied in flexible circuit scenarios

Copper-coated polyimide film applied in flexible circuit scenarios

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Copper-coated polyimide film applied in flexible circuit scenarios

Copper-coated polyimide film applied in flexible circuit scenarios


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