Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry
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Copper-Clad Polyimide Film (abbreviated as PI Copper Foil) is a high-performance composite material specifically developed for flexible circuit scenarios. It combines high-purity copper foil with a polyimide (PI) base film through a precision lamination process, integrating the bend resistance of flexible substrates and the electrical conductivity of metal conductors. As a core foundational material for flexible electronic devices, it enables the realization of "thinness, lightness, bendability, and high reliability"
Robust Mechanical Durabilit
Exceptional Dimensional Integrity
Excellent Lamination Performance
Compliant with RoHS and REACH
