Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry

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Polyimide-film-based, precision-laminated copper substrate for flexible circuits

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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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City:hefei
Country/Region:china
Contact Person:MrJihao
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Polyimide-film-based, precision-laminated copper substrate for flexible circuits

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Brand Name :Guofeng
Model Number :25um
Certification :SGS Reach ROHS
Place of Origin :China
MOQ :150kg
Price :$300-$30000
Payment Terms :L/C,T/T
Supply Ability :Negotiation
Delivery Time :7 Working Days
Packaging Details :Standard Packing
Cladding Material :Copper
Surface Treatment :Chemical Etching
Material :Polyimide
Adhesive Type :Acrylic
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Polyimide-film-based, precision-laminated copper substrate for flexible circuits
Product Overview:

The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, boosting essential properties like tensile strength, dimensional stability, and chemical resistance by a consistent 30%. This versatile, naturally yellow film is available in custom thicknesses and is the ideal solution for demanding uses such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Robust Mechanical Durabilit

Exceptional Dimensional Integrity

Excellent Lamination Performance
Compliant with RoHS and REACH


Product Applications:

Serves as a base material for high-precision adhesive Flexible Copper Clad Laminates (FCCL)
Functions as a highly dimensionally stable cover layer
Applied in semiconductor chip packaging
Used as a base film for specialized adhesive tapes


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Polyimide-film-based, precision-laminated copper substrate for flexible circuits

Polyimide-film-based, precision-laminated copper substrate for flexible circuits

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Polyimide-film-based, precision-laminated copper substrate for flexible circuits

Polyimide-film-based, precision-laminated copper substrate for flexible circuits

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