Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry
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This next-generation polyimide film substrate incorporates proprietary nanoparticle reinforcement to overcome traditional limitations in flexible electronics. With a 40% improvement in mechanical durability and 35% higher thermal conductivity compared to standard polyimide films, it enables thinner, more reliable, and thermally efficient flexible circuits. The material maintains excellent electrical insulation properties while providing unprecedented dimensional stability across a wide temperature range (-269°C to 400°C), making it ideal for advanced applications where conventional materials fail.
Enhanced Thermal Management
Thermal conductivity up to 0.8 W/m·K (2X conventional PI films)
Coefficient of thermal expansion (CTE) reduced to <10 ppm/°C (60% improvement)
Superior Mechanical Performance
40% higher tear resistance and 30% improved tensile strength
Withstands over 200,000 dynamic flex cycles at 3mm bend radius
Advanced Processing Compatibility
Laser-drillable with 20μm microvias for HDI circuits
Compatible with thin-film transistor and semiconductor packaging processes
Reliability in Extreme Conditions
Maintains performance after 1000 hours at 85°C/85% RH
UV laser processable for high-precision patterning
Flexible Displays: OLED substrate and touch sensor layers
Medical Electronics: Implantable devices and flexible sensors
Aerospace: Lightweight wiring systems and satellite components
Wearable Technology: Advanced biometric monitoring systems
Automotive: Flexible lighting systems and curved interior electronics
This isn't just another polyimide film - it's a fundamentally advanced material platform enabling previously impossible flexible electronic designs. The combination of thermal, mechanical, and electrical properties creates new opportunities for innovation while providing unmatched reliability in demanding applications.
