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Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
As a cornerstone engineering material for next-gen electronic systems, GL-specification polyimide substrates deliver mission-critical operational parameters across: 1) micron-precision adhesive flexible copper-clad laminate architectures, 2) thermally invariant protective overlay systems, 3) cutting-edge chip-scale encapsulation platforms, and 4) application-specific pressure-sensitive tape formulations.